Szczegóły Szczegóły PDF BIBTEX RIS Tytuł artykułu Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses Tytuł czasopisma Archives of Metallurgy and Materials Rocznik 2017 Wolumin vol. 62 Numer No 2 Autorzy Eun Byeol Choi ; Lee, Jong-Hyun Wydział PAN Nauki Techniczne Wydawca Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences Data 2017 Identyfikator DOI: 10.1515/amm-2017-0166 ; e-ISSN 2300-1909 Źródło Archives of Metallurgy and Materials; 2017; vol. 62; No 2 Referencje Eom (2011), ETRI J, 33. ; Qiao (2014), J Adhes Adhes, 48, 159. ; Le (2006), IEEE Trans Compon Packag Technol, 29, 758. ; Zhao (2011), Solid State Chem, 184. ; Ren (2015), ACS Appl Mater Interfaces, 7, 13685. ; Kang (1999), Electron Mater, 28, 1314. ; Hai (2006), Surf Coat Technol, 201. ; Zhang (2008), J Adhes Adhes, 30, 1673. ; Chee (2014), Mater Chem, 5372. ; Choi (2015), Alloys Compd, 643. ; Yang (2013), Mater Chem, 4052. ; Fu (2014), Appl Therm Eng, 66. ; Xu (2003), Mater Lett, 57. ; Park (2007), Thin Solid Films, 515. ; Krupa (2013), Mater Des, 51. ; Eom (2015), of Friedrichshafen, Proceedings European Microelectronics Packaging Conference IEEE, 1. ; Ye (1999), IEEE Trans Electron Packag Manuf, 22, 299. ; Yim (2008), Adhes Sci Technol, 22, 1593.