At the ice edge krill undergoes diurnal migrations with the period of 12 hours and amplitude of about 6 meters. The mean depth of krill occurrence is 41 m, shallower then for open waters. In our opinion these migration parameters are characteristic of juvenile adolescent krill dominating at the ice edge.

Ice thickness is one of the most critical physical indicators in the ice science and engineering. It is therefore very necessary to develop in-situ automatic observation technologies of ice thickness. This paper proposes the principle of three new technologies of in-situ automatic observations of sea ice thickness and provides the findings of laboratory applications. The results show that the in-situ observation accuracy of the monitor apparatus based on the Magnetostrictive Delay Line (MDL) principle can reach ±2 mm, which has solved the “bottleneck” problem of restricting the fine development of a sea ice thermodynamic model, and the resistance accuracy of monitor apparatus with temperature gradient can reach the centimeter level and research the ice and snow substance balance by automatically measuring the glacier surface ice and snow change. The measurement accuracy of the capacitive sensor for ice thickness can also reach ±4 mm and the capacitive sensor is of the potential for automatic monitoring the water level under the ice and the ice formation and development process in water. Such three new technologies can meet different needs of fixed-point ice thickness observation and realize the simultaneous measurement in order to accurately judge the ice thickness.

The article presents the analysis of the simulation test results for three variants of the power electronics used as interface between the power network and superconducting magnetic energy storage (SMES) with the following parameters: power of 250 kW, current of 500 A DC and voltage of 500 V DC. Three interface topologies were analyzed: two-level AC-DC and DC-DC converters; three-level systems and mixed systems combining a three-level active rectifier and a two-level DC-DC converter. The following criteria were considered: input and output current and voltage distortions, determined as THDi and THDu, power losses in power electronics components; cost of the semiconductor components for each topology and total cost of the interface. Results of the analysis showed that for high-power low-voltage and high-current power electronics systems, the most advantageous solution from a technical and economical perspective is a two-level interface configuration in relation to both AC-DC and DC-DC converters.