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Abstrakt

FeCl3 bearing etching solution is mainly used for etching of metals used in shadow masks, PCBs and so on. Due course of Invar alloy etching process the FeCl3 bearing etching solution get contaminated with Ni2+ which affect adversely the etching efficiency. Hence, FeCl3 bearing etching solution discarded after several cycle of operation causes an environmental and economic problem. To address both the issues the etching solution was purified through solvent extraction and remained Ni2+ recovered by wet chemical reduction using hydrazine. For optimum Fe3+ extraction efficiency, various extraction parameter were optimized and size and morphology of the recovered pure Ni powder was analyzed. The reported process is a simple process to purify and recover Ni from industry etching solution.

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Autorzy i Afiliacje

Il-Jeong Park
Basudev Swain
Dae-Weon Kim
Geon-Hong Kim
Deok-Hyun Han
Hang-Chul Jung

Abstrakt

In the past few years, overhead copper transmission lines have been replaced by lightweight aluminum transmission lines to minimize the cost and prevent the sagging of heavier copper transmission lines. High strength aluminum alloys are used as the core of the overhead transmission lines because of the low strength of the conductor line. However, alloying copper with aluminum causes a reduction in electrical conductivity due to the solid solution of each component. Therefore, in this study, the authors attempt to study the effect of various Al/Cu ratios (9:1, 7:3, 5:5) to obtain a high strength Al-Cu alloy without a significant loss in its conductivity through powder metallurgy. Low-temperature extrusion of Al/Cu powder was done at 350ºC to minimize the alloying reactions. The as-extruded microstructure was analyzed and various phases (Cu9Al4, CuAl2) were determined. The tensile strength and electrical conductivity of different mixing ratios of Al and Cu powders were studied. The results suggest that the tensile strength of samples is improved considerably while the conductivity falls slightly but lies within the limits of applications.

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Autorzy i Afiliacje

Deokhyun Han
ORCID: ORCID
Geon-Hong Kim
Jaesung Kim
Byungmin Ahn
ORCID: ORCID

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