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[References = "<i>International Technology Roadmap for Semiconductors<\/i> <a target=\"_blank\" href='http\:\/\/www.itrs.net\/'>http\:\/\/www.itrs.net\/<\/a>"]
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Bulletin of the Polish Academy of Sciences Technical Sciences (2)
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Heat dissipation and temperature distribution in long interconnect lines
K. Gnidzinska
G. De Mey
A. Napieralski
Bulletin of the Polish Academy of Sciences Technical Sciences | 2010 | 58 | No 1
| 119-124 | DOI:
10.2478/v10175-010-0012-8
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Authors and Affiliations
K. Gnidzinska
G. De Mey
A. Napieralski
Modelling of the microstructure and properties in the length scales varying from nano- to macroscopic
K. Kurzydlowski
Bulletin of the Polish Academy of Sciences Technical Sciences | 2010 | 58 | No 2
| 217-226 | DOI:
10.2478/v10175-010-0021-7
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Authors and Affiliations
Authors and Affiliations
K. Kurzydlowski
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