Analytical transmission electron microscopy has been applied to characterize the microstructure, phase and chemical composition of the Ag–Al wear track throughout its thickness down to the atomic level. Microscopy findings have been correlated with Ag–Al film tribological properties to understand the effect of the hexagonal solid solution phase on the tribological properties of this film. Ag–25Al (at.%) films have been produced by simultaneous magnetron sputtering of components in Ar atmosphere under 1 mTorr pressure and subjected to pin-on-disc tribological tests. It has been shown that hcp phase with (001) planes aligned parallel to the film surface dominates both in as-deposited and in tribofilm areas of the Ag–Al alloy film. Possible mechanisms of reduced friction in easily oxidized Ag–Al system are discussed and the mechanism based on readily shearing basal planes of the hcp phase is considered as the most probable one.
Ag and Cu powders were mechanically alloyed using high-energy planetary milling to evaluate the sinter-bonding characteristics of a die-attach paste containing particles of these two representative conductive metals mixed at atomic scale. This resulted in the formation of completely alloyed Ag-40Cu particles of 9.5 µm average size after 3 h. The alloyed particles exhibited antioxidation properties during heating to 225°C in air; the combination of high pressure and long bonding time at 225°C enhanced the shear strength of the chip bonded using the particles. Consequently, the chips sinter-bonded at 225°C and 10 MPa for 10 min exhibited a sufficient strength of 15.3 MPa. However, an increase in bonding temperature to 250°C was detrimental to the strength, due to excessive oxidation of the alloyed particles. The mechanically alloyed phase in the particle began to decompose into nanoscale Ag and Cu phases above a bonding temperature of 225°C during heating.
The article describes the influence of anomalous values and local variability on the structure of variability and the estimation of deposit parameters. The research was carried out using statistical and geostatistical methods based on the Pb accumulation index in the shale series in part of the Cu-Ag ore deposit, LGCD (Lubin-Głogów Copper District). The authors recommend the use of a geostatistical tool, the so-called semivariogram cloud to determine the anomalous values. Anomalous values determined by the geostatistical method and removed from the dataset have resulted in a significant reduction of the relative variability of data, which is still very large in the case of the analyzed parameter or parameters with similar statistical features such as extreme variability and strongly asymmetric distribution. Calculations of the resources of this element can be treated only as estimates and formally classified to category D. The hypothetical assumption of the absence of sampling errors, resulting in a decrease in the magnitude of local variation, leads to a certain reduction of the median error of resource estimates. However, they are still high (> 35%). This is due to the large natural variability of the accumulation index of Pb on the local observation scale. The current method for collecting samples from mine workings of the Cu-Ag deposits in the Lubin-Głogów Copper District (LGCD), aimed at the proper assessment of copper resources, the Cu content, and at estimating the quality of copper output, makes it impossible to achieve an accuracy of estimates of Pb resources similar to that obtained for the main metal. Theoretically, this effect can be achieved by a strong concentration of the sample collection points and thanks to a multiple increase in the samples weight; this, however, is unrealistic for both economic and organizational reasons. It is therefore to be expected that the assessment of Pb resources and other accompanying elements of similar statistical features (e.g. As), located in parts of the deposit where mining activities are to be carried out, will be subject to significant errors.
This study stacked a thin, dense BCuP-5 (Cu-Ag-P based filler metal) on a Cu-plate using the laser cladding (L.C) process to develop a method to manufacture Ag reducing multilayer clad electrical contact material with an Ag-M(O)/Ag/Cu/BCuP-5 structure. Then, the microstructure and macroscopic properties of the manufactured BCuP-5 coating layer were analyzed. The thickness of the manufactured coating layer was approximately 1.7 mm (maximum). Microstructural observation of the coating layer identified Cu, Ag and Cu-Ag-Cu3P ternary eutectic phases like those in the initial BcuP-5 powder. To evaluate the properties of the manufactured coating layer, hardness and adhesion strength tests were performed. The average hardness of the laser cladded coating layer was 183.2 Hv, which is 2.6 times greater than conventional brazed BcuP-5. The average pull-off strength measured using the stud pull test was 341.6 kg/cm2. Cross-sectional observation of the pulled-off material confirmed that the coating layer and substrate maintained a firm adhesion after pull-off. Thus, the actual adhesion strength of Cu/BcuP-5 was inferred to be greater than 341.6 kg/cm2. Based on the above findings, it was confirmed that it is possible to manufacture a sound Ag reducing multilayer clad electrical contact material using the laser cladding process.