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Abstrakt

This paper presents low-cost, configurable PCI Express (PCIe) direct memory access (DMA) interface for implementation on Intel Cyclone V FPGAs. The DMA engine was designed to support DAQ tasks including pre-triggering acquisition for transient analysis and multichannel transmission. Performance of the interface has been evaluated on Terasic OVSK board (PCIe Gen2 x4). Target configuration of this interface is based on the Avalon-MM Hard IP for Cyclone V PCIe core and Jungo WinDriver x64 for Windows. A sample speed of 1200 MB/s has been reported for DMA writes to PCIe memory.
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Bibliografia

[1] PCI Express Base Specification, rev. 3.0, PCI-SIG, Nov. 2010
[2] A. Wójcik, R. Łukaszewski, R. Kowalik, W. Winiecki, “Nonintrusive Appliance Load Monitoring: An Overview, Laboratory Test Results and Research Directions”, Sensors, 2019, 19, 3621
[3] A. Wójcik, P. Bilski, R. Łukaszewski, K. Dowalla, R. Kowalik, “Identification of the State of Electrical Appliances with the Use of a Pulse Signal Generator”, Energies, 2021, 14, 673.
[4] K. N. Trung, E. Dekneuvel, B. Nicolle, O. Zammit, C. N. Van, G. Jacquemod, “Using FPGA for Real Time Power Monitoring in a NIALM System”, In Proc. 2013 IEEE International Symposium on Industrial Electronics (ISIE), 2013, pp. 1-6
[5] Intel Corporation, Modular Scatter-Gather DMA Core, In Embedded Peripherals IP User Guide v. 18.1
[6] Intel Corporation, Intel® Quartus® Prime Standard Edition User Guide v. 18.1, Platform Designer
[7] Intel Corporation, Cyclone® V Avalon® Memory Mapped (Avalon-MM) Interface for PCIe Solutions User Guide, UG-01110, 2020
[8] Intel Corporation,V-Series Avalon-MM DMA Interface for PCIe Solutions User Guide, UG-01154, 2016
[9] WinDriver, https://www.jungo.com/st/products/windriver/wd_windows/
[10] OpenVINO Stater Kit GT Edition User Manual, available on https://www.terasic.com.tw/
[11] L. Rota, M. Caselle, S. Chilingaryan, A. Kopmann, M. Weber, “A PCIe DMA Architecture for Multi-Gigabyte Per Second Data Transmission”, IEEE Transactions on Nuclear Science, vol. 62, no. 3, 2015, pp. 972 - 976
[12] A. Byszuk, J. Kołodziejski, G. Kasprowicz, K. Późniak, W. M. Zabołotny “Implementation of PCI Express bus communication for FPGA-based data acquisition systems”, In Proceedings of SPIE Vol. 8454, 2015
[13] L. Boyang, “Research and Implementation of XDMA High Speed Data Transmission IP Core Based on PCI Express and FPGA”, in 2019 IEEE 1st International Conference on Civil Aviation Safety and Information Technology (ICCASIT), Oct. 2019, pp. 408–411
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Autorzy i Afiliacje

Krzysztof Mroczek
1

  1. Institute of Radioelectronics and Multimedia Technology, Warsaw University of Technology, Poland

Abstrakt

The article has presented the method of 3D Digital Light Processing printing as one of the technologies used for rapid prototyping of dental models and making elements of dentures. In this work the research was presented, which the aim was to determine the effect of additional exposure time on the properties of the obtained printouts. Dynamic Mechanical Analysis test showed significant differences in stiffness between uncured specimens as well as specimens cured for 10, 20 and 30 minutes. In turn the obtained TG and DTG curves allowed to determine the most optimal curing time for DLP printouts. These studies provide the basis for determining the most appropriate method for handling printouts after the process of printing from liquid resin, so that they are the best possible quality for dentists and prosthodontists.
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Autorzy i Afiliacje

J. Redutko
1
ORCID: ORCID
A. Kalwik
1
ORCID: ORCID
A. Szarek
1
ORCID: ORCID

  1. Czestochowa University of Technology, Faculty of Mechanical Engineering and Computer Science, Department of Technology and Automation,21 Armii Krajowej Av., 42-201 Czestochowa, Poland

Abstrakt

The article presents the results of research on selected thermal, mechanical properties, as well as the microscopic structure of filaments and details made on a 3D printer in FDM technology. The materials used in the study were PETG (polyethylene terephthalate doped with glycol) and PLA (polylactide) doped with copper. As part of the study, Differential Scanning Calorimetry (DSC) was performed in order to determine the temperatures of phase transformations and changes in melting enthalpy values of filaments before the printing process and also elements made of them. The second part of the research was electrocorrosive ageing process of printouts, carried out in the Simulated Body Fluid solution in a device generating 0.3 A direct current, voltage with value 4.3 V for the entire duration of the test, which was 720 h. After this process DSC test was conducted again. The next stage of the research was Dynamic Mechanical Analysis (DMA) of printouts before and after electrocorrosive ageing process. This test was carried out to characterize the dynamic-mechanical properties as a function of frequency, temperature and time. Additionally, microscopic analyses of the surfaces of the tested printouts were performed in order to assess the changes after electrolysis.
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Autorzy i Afiliacje

J. Redutko
1
ORCID: ORCID
A. Kalwik
1
ORCID: ORCID
A. Szarek
1
ORCID: ORCID

  1. Czestochowa University of Technology, Faculty of Mechanical Engineering and Computer Science, Department of Technology and Automation, 21 Armii Krajowej Av., 42-201 Czestochowa, Poland

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