Details

Title

Electroacoustic Analysis of a Controlled Damping Planar CMOS-MEMS Electrodynamic Microphone

Journal title

Archives of Acoustics

Yearbook

2015

Volume

vol. 40

Issue

No 4

Authors

Keywords

MEMS sensor ; acoustical model ; monolithic electroacoustic microphone ; suspended diaphragm ; lumped element modeling

Divisions of PAS

Nauki Techniczne

Coverage

527-537

Publisher

Polish Academy of Sciences, Institute of Fundamental Technological Research, Committee on Acoustics

Date

2015[2015.01.01 AD - 2015.12.31 AD]

Type

Artykuły / Articles

Identifier

DOI: 10.1515/aoa-2015-0052

Source

Archives of Acoustics; 2015; vol. 40; No 4; 527-537

References

Merhaut (1981), Theory of Electroacoustics, USA. ; Kühnel (1992), Micromachined subminiature condenser microphones in silicon Sensors and, Actuators, 32. ; Kronast (2001), Single chip condenser microphone using porous silicon as sacrificial layer for the air gap Sensors and, Actuators, 87. ; Beranek (1954), Acoustics New York, USA. ; Tounsi (2009), Highly Flexible Membrane Systems for Micromachined Microphones Modeling and Simulation Proceedings of the rd on Signals Circuits and Systems pp, Int Tunisia, 3. ; Blackstock (2000), Fundamentals of Physical Acoustics, USA. ; Ma (2015), Advanced MEMS - based technologies and displays, Displays Journal, 37. ; Chen (2008), Modeling and simulation of a condenser microphone Sensors and, Actuators, 145. ; Kovacs (1998), Bulk micromachining of silicon, Proc IEEE, 86, 1536, doi.org/10.1109/5.704259 ; Abuelma atti (2007), Large signal performance of micromachined silicon inductive microphones of, Journal Applied Acoustics, 68, 10. ; Olson (1976), Acoustical Engineering Princeton, USA. ; Sheplak (1998), A wafer - bonded silicon - nitride membrane microphone with dielectrically - isolated single - crystal silicon piezoresistors Technical Digest Solid - State Sensor and Actuator Workshop Transducer Res Cleveland, USA, 23, 26. ; Horng Ray (2010), Fabrication of a dual - planar - coil dynamic microphone by MEMS techniques of Micromechanics and Microengineering, Journal, 20, 1.
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