Tytuł artykułu

A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography

Tytuł czasopisma

Archives of Metallurgy and Materials

Rocznik

2024

Wolumin

vol. 69

Numer

No 2

Autorzy

Tan, C.Y. ; Mohd Salleh, M.A.A. ; Saud, N. ; Nabialek, M. ; Rylski, A.

Afiliacje

Tan, C.Y. : Universiti Malaysia Perlis, Centre of Excellent on Geopolymer and Green Technology (CEGeoGTech), 02600 Perlis, Malaysia ; Mohd Salleh, M.A.A. : Universiti Malaysia Perlis, Centre of Excellent on Geopolymer and Green Technology (CEGeoGTech), 02600 Perlis, Malaysia ; Saud, N. : Universiti Malaysia Perlis, Centre of Excellent on Geopolymer and Green Technology (CEGeoGTech), 02600 Perlis, Malaysia ; Nabialek, M. : Czestochowa University of Technology, Department of Physics, Faculty of Production Engineering and Materials Technology,42-200 Czestochowa, Poland ; Rylski, A. : Lodz University of Technology, Institute of Materials Science and Engineering, 90-924 Lodz, Poland

Słowa kluczowe

Synchrotron tomography ; SPring-8 ; Solder joint ; 3D microstructure

Wydział PAN

Nauki Techniczne

Zakres

661-665

Wydawca

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Data

21.06.2024

Typ

Article

Identyfikator

DOI: 10.24425/amm.2024.149795 ; e-ISSN 2300-1909