Tytuł artykułu

Effect of variable thermal conductivity in semiconducting medium underlying an elastic half-space

Tytuł czasopisma

Archives of Thermodynamics

Rocznik

2024

Wolumin

vol. 45

Numer

No 3

Autorzy

Ailawalia, Praveen ; Priyanka

Afiliacje

Ailawalia, Praveen : Department of Mathematics, University Institute of Sciences, Chandigarh University, Gharuan, Mohali, Punjab, India ; Priyanka : I.G.N College, Ladwa, Haryana, India

Słowa kluczowe

Semiconducting medium ; Thermal conductivity ; Temperature distribution ; Normal mode analysis ; Carrier density

Wydział PAN

Nauki Techniczne

Zakres

159-166

Wydawca

The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of Sciences

Data

12.07.2024

Typ

Article

Identyfikator

DOI: 10.24425/ather.2024.151226 ; ISSN 1231-0956 ; eISSN 2083-6023

Rada naukowa

International Advisory Board

J. Bataille, Ecole Central de Lyon, Ecully, France

A. Bejan, Duke University, Durham, USA

A. C. Benim, Duesseldorf University of Applied Sciences, Germany

W. Blasiak, Royal Institute of Technology, Stockholm, Sweden

G. P. Celata, ENEA, Rome, Italy

L.M. Cheng, Zhejiang University, Hangzhou, China

M. Colaco, Federal University of Rio de Janeiro, Brazil

J. M. Delhaye, CEA, Grenoble, France

M. Giot, Université Catholique de Louvain, Belgium

K. Hooman, University of Queensland, Australia

D. Jackson, University of Manchester, UK

D.F. Li, Kunming University of Science and Technology, Kunming, China

K. Kuwagi, Okayama University of Science, Japan

J. P. Meyer, University of Pretoria, South Africa

S. Michaelides, Texas Christian University, Fort Worth Texas, USA

M. Moran, Ohio State University, Columbus, USA

W. Muschik, Technische Universität Berlin, Germany

I. Müller, Technische Universität Berlin, Germany

H. Nakayama, Japanese Atomic Energy Agency, Japan

S. Nizetic, University of Split, Croatia

H. Orlande, Federal University of Rio de Janeiro, Brazil

M. Podowski, Rensselaer Polytechnic Institute, Troy, USA

A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine

M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA

A. Vallati, Sapienza University of Rome, Italy

H.R. Yang, Tsinghua University, Beijing, China