Details
Title
Online Monitoring of Thermal Loads of Steam Turbine ComponentsJournal title
Archives of ThermodynamicsYearbook
2025Volume
vol. 46Issue
No 3Authors
Affiliation
Banaszkiewicz, M. : Institute of Fluid-Flow Machinery, Polish Academy of Sciences, Energy Conversion Department, ul. Fiszera 14, 80-231 Gdańsk, PolandKeywords
Steam turbine ; Thermal loads ; Condensation ; Duhamel’s integralDivisions of PAS
Nauki TechniczneCoverage
5-15Publisher
The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of SciencesDate
28.10.2025Type
ArticleIdentifier
DOI: 10.24425/ather.2025.154920Editorial Board
International Advisory BoardJ. Bataille, Ecole Central de Lyon, Ecully, France
A. Bejan, Duke University, Durham, USA
A. C. Benim, Duesseldorf University of Applied Sciences, Germany
W. Blasiak, Royal Institute of Technology, Stockholm, Sweden
G. P. Celata, ENEA, Rome, Italy
L.M. Cheng, Zhejiang University, Hangzhou, China
M. Colaco, Federal University of Rio de Janeiro, Brazil
J. M. Delhaye, CEA, Grenoble, France
M. Giot, Université Catholique de Louvain, Belgium
K. Hooman, University of Queensland, Australia
D. Jackson, University of Manchester, UK
D.F. Li, Kunming University of Science and Technology, Kunming, China
K. Kuwagi, Okayama University of Science, Japan
J. P. Meyer, University of Pretoria, South Africa
S. Michaelides, Texas Christian University, Fort Worth Texas, USA
M. Moran, Ohio State University, Columbus, USA
W. Muschik, Technische Universität Berlin, Germany
I. Müller, Technische Universität Berlin, Germany
H. Nakayama, Japanese Atomic Energy Agency, Japan
S. Nizetic, University of Split, Croatia
H. Orlande, Federal University of Rio de Janeiro, Brazil
M. Podowski, Rensselaer Polytechnic Institute, Troy, USA
A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine
M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA
A. Vallati, Sapienza University of Rome, Italy
H.R. Yang, Tsinghua University, Beijing, China